乐泰LOCTITEECCOBOND NCF218透明膜

LOCTITE ABLESTIK NCF 218 transparent film is specially formulated for Pb free, low κ, thin gap, large and thin die used in advance flip chip applications. This material is suitable for die to die, die to wafer (TSV) or die to substrate applications.

LOCTITE ABLESTIK NCF 218透明膜是专门为高级倒装芯片应用中的无
铅、低间隙、大而薄的芯片而配制的。这种材料适用于芯片对芯片、芯
片对芯片(TSV或芯片对衬底应用。