乐泰LOCTITEECCOBOND 8000AA芯片粘接

LOCTITEECCOBONDUF8000AAunderfillisspecially
designed for flip chip BGA device applications.It is formulated
to improve crackiracure resisiance and provide faster flow!
When fully cured. this material forms a rigid low stress seal
that dissipates stress in solder joints and extends thermal
cyclingperformance
乐泰ECCOBOND8000AA部填充是专门为倒装芯片BGA件应用
而设计的。它的配方可提高抗裂/断裂性能，并提供更快的流动
性完全固化后，这种材料可形成刚性、低应力密封，消除焊点中
的应力，并延长热循环性能。