LoctiteECCOBONDFP549液体环氧胶粘剂是为增强与集成电路钝化
材料的粘附而设计的。这种材料是用来在90摄氏度到110摄氏度快速填
充设备的,只有1/2毫升的间隙。当完全固化时,材料形成一个刚性的
低应力密封,它能消除焊点上的应力并延长热循环性能。
LOCTITE ECCOBOND FP4549 liquid epoxy adhesive is designed for
enhanced adhesion to integrated circuit passivation materials. This
material is formulated to quickly underfill devices at 90°C to 110°C with
as little as a 1/2 mil gap. When fully cured, the material forms a rigid,
low stress seal that dissipates stress on solder joints and extends
thermal cycling performance.